Date: Jul 08, 2011 Source: Environmental Protection Agency (
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Conventional processes used to apply thin film coatings on electric devices generate significant water pollution, process waste, and toxic effluent. The most common coating processes—sputtering, evaporation, Chemical Vapor Deposition, and electroplating — are not always compatible with heat sensitive substrates and semiconductor processes, and they provide only moderate output at a high cost. Jet Process Corporation has developed an innovative, carbon-free process without toxic precursors or effluents to manufacture high-quality coatings on substrates for various applications. The Jet Vapor Deposition™ (JVDTM) process can use various metal sources, including gold, chromium, nickel, copper, zinc, iron, tin, and silver; and, the resultant coatings are equivalent or superior to conventional coatings, environmentally friendly, and more cost effective. The company specializes in deposition of gold-tin and other lead-free solders. The process allows easy sequential or simultaneous deposition of multiple metal components, enabling a reproducible combination of complex layers and alloys. JVD™ coatings are used by leading manufacturers of microelectronics, semiconductor packaging, advanced sensors, solid state lighting, optoelectronics, telecommunications, and MEMs components. The company holds more than 30 U.S. and foreign patents and provides high-quality coatings for diverse industrial, consumer, and military applications.
