Jet Process Corporation (JPC), formerly Schmitt Technology Associates, is a privately held thin film deposition service. The firm is the sole owner and developer of the versatile Jet Vapor DepositionTM (JVDTM) process for thin film solders and other thin film metal coatings. Specializing in the deposition of lead free solders; these include eutectic and off-eutectic Gold-Tin, the Tin-Silver-Copper family, Indium and Indium alloys, and virtually all other lead free solder alloys. The firm also deposit related adhesion layers and diffusion barriers such as TiPtAu and TiNiAu. JVD's low temperature and low vacuum operating conditions are compatible with photoresist patterns, heat sensitive substrates, and mask materials, including materials which outgas. JVD technology has provided solder bumps for advanced technology applications in: semiconductor packaging; MEMS; microelectronics; optoelectronics; photonics; microwave devices; advanced sensors;bio-medical and aerospace. JVD offers many advantages over conventional techniques such as sputtering, evaporation, CVD and electroplating, and has demonstrated its versatility in a wide variety of contract R&D and production work. JVD is an economical, safe, clean and environmentally sound process. In addition to our solder specialty, we have a growing program in deposition of Platinum nanocluster films with high surface areas, for biomedical and other uses.
