SBIR-STTR Award

Reverse Engineering of 2 CCAs and Power Supply P2 for DSM-157 Maverick Missile Test Set (AGM-65)
Award last edited on: 1/27/2023

Sponsored Program
SBIR
Awarding Agency
DOD : DLA
Total Award Amount
$1,092,402
Award Phase
2
Solicitation Topic Code
DLA192-001
Principal Investigator
Erick M Spory

Company Information

Global Circuit Innovations Inc

4182 Center Park Drive
Colorado Springs, CO 80916
   (719) 573-6777
   N/A
   www.gci-global.com
Location: Single
Congr. District: 05
County: El Paso

Phase I

Contract Number: SP4701-20-P-0012
Start Date: 11/13/2019    Completed: 5/12/2020
Phase I year
2020
Phase I Amount
$99,980
SBIR Phase I DLA192-001 represents a requirement for Reverse Engineering (RE) of an obsolete Circuit Card Assembly (CCA). In this SBIR Phase I effort, Global Circuit Innovations (GCI) will collect and organize all available specifications and drawings for NSN: 5998-01-255-1802. GCI will visit the organization responsible for supporting this requirement to acquire as much information as possible. GCI will request to see the physical CCA and, if possible, take one sample CCA for further analysis and evaluation. GCI will locate a source (through procurement or identify a GCI redesign effort if required) for all of the components on the CCA and will create a schematic, if one is not already available, for this CCA. A schematic can be created even in the absence of a Technical Data Package (TDP) from an analysis of the CCA. GCI will also create a Source Approval Package (SAR). This information would later be used in a follow-on SBIR Phase II to layout, manufacture, populate and fully test a form, fit and function, backwards-compatible CCA that works perfectly in the customer’s system.

Phase II

Contract Number: SP4701-22-C-0006
Start Date: 11/4/2021    Completed: 5/3/2023
Phase II year
2022
Phase II Amount
$992,422
Global Circuit Innovations (GCI) uses proprietary technology and engineering methods for resolving obsolescence issues in microcircuits (i.e., computer chips), and Circuit Card Assemblies (or CCAs)r, typically containing many microcircuits assembled on a printed circuit card assembly). Although each problem is unique, requiring a custom solution, GCI’s core technology has been consistently proven in both industrial as well as DoD applications. Varying levels of re-engineering are required depending on the extent of the available data package for the original electronics, followed by development of a unique product solution. GCI creates form, fit, and function drop-in replacement electronics that can be seamlessly integrated into a larger electronics system as required. The replacement electronic components will work identically to the original obsolete components. The GCI approach typically saves 80% of the cost, and 75% of the schedule relative to a system redesign. It has been determined that there is a need for replacements of two obsolete Circuit Card Assemblies (CCAs) and a Power Supply (P2) for the DSM-157 Maverick Missile Test Set (AGM-65). The CCAs are NSN 5998-01-191-1647 (A1A1A4), NSN 5998-01-189-6238 (A1A1A10), and the Power Supply NSN 6130-01-189-1327 (P2). The ESA (Engineering Support Authority) for this project is Alex Matesen C CIV USAF AFMC AFLCMC/EBHGA at Hill AFB, UT. GCI has determined a path forward to reverse engineer these three obsolete components to provide form, fit and function drop-in replacements that will be rugged and highly reliable and will meet all specifications in a Phase II effort. Each component will be thoroughly tested and work successfully in the customer’s next higher assemblies: SRU and LRU.