Global Circuit Innovations (GCI) uses proprietary technology and engineering methods for resolving obsolescence issues in microcircuits (i.e., computer chips), and Circuit Card Assemblies (or CCAs)r, typically containing many microcircuits assembled on a printed circuit card assembly). Although each problem is unique, requiring a custom solution, GCIs core technology has been consistently proven in both industrial as well as DoD applications. Varying levels of re-engineering are required depending on the extent of the available data package for the original electronics, followed by development of a unique product solution. GCI creates form, fit, and function drop-in replacement electronics that can be seamlessly integrated into a larger electronics system as required. The replacement electronic components will work identically to the original obsolete components. The GCI approach typically saves 80% of the cost, and 75% of the schedule relative to a system redesign. It has been determined that there is a need for replacements of two obsolete Circuit Card Assemblies (CCAs) and a Power Supply (P2) for the DSM-157 Maverick Missile Test Set (AGM-65). The CCAs are NSN 5998-01-191-1647 (A1A1A4), NSN 5998-01-189-6238 (A1A1A10), and the Power Supply NSN 6130-01-189-1327 (P2). The ESA (Engineering Support Authority) for this project is Alex Matesen C CIV USAF AFMC AFLCMC/EBHGA at Hill AFB, UT. GCI has determined a path forward to reverse engineer these three obsolete components to provide form, fit and function drop-in replacements that will be rugged and highly reliable and will meet all specifications in a Phase II effort. Each component will be thoroughly tested and work successfully in the customers next higher assemblies: SRU and LRU.