Global Circuit Innovations (GCI) Inc. develops reverse engineering IC solutions for obsolescence and high temperature environments. The firm's Die Extraction & Repackaging (DER) and its unique ENEPIG plating & repackaging (DEER) technologies are valuable tools GCI utilizes to provide form, fit and function (F3) drop-in replacements for otherwise obsolete Integrated Circuits (ICs), Circuit Card Assemblies (CCAs), Line Replacement Units (LRUs) and High-temperature and Harsh Environments. GCIs staff averages over 20 years of semiconductor experience that includes IC Process Development, IC & CCA Design, Assembly, Test, Failure Analysis, Silicon Foundry Operations, and Program Management
