Recent advanced in advanced manufacturing vacuum-integrated cluster-tool processing have shown that many processing steps are amenable to single wafer processing (SWP). However, advanced in wafer cleaning and photoresist processing have not progressed to the point where they can be effectively integrated into the vacuum-integrated cluster-tool processor. This program outlines areas of basic research on all dry photoresist and wafer cleaning techniques, which provide equal or better process performance to currently used liquid based processes. Successful development of all dry photoresist wafer cleaning techniques will have significant positive impact on the economics of vacuum-integrated cluster-tool processing and may provide a driving force for the increased use of vacuum-integrated cluster-tool processors in a manufacturing environment. ANTICIPATED
Benefits: The successful development of all dry photoresist and wafer cleaning techniques will increase the driving force of the application of vacuum-integrated cluster tool processing. Additional benefits of all dry processing include reduced contamination and reductions in the use of ultrapure water and reduce supply and disposal of hazardous liquid chemicals.
