Date: Jan 19, 2012 Source: United Silicon Carbide (
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United Silicon Carbide Inc. (USCi), based in Monmouth Junction, NJ, USA, is developing the next generation of SiC devices utilizing the AIXTRON VP2400 Hot-Wall CVD tool. The order was placed in the fourth quarter of 2011 and is planned to be delivered in third quarter 2012.
Dr. Frank Wischmeyer, Vice President and Managing Director, AIXTRON AB, Sweden: "Our SiC Planetary Reactor® technology has continued to evolve over the past 10 years. Our extensive experience and know-how in the SiC deposition process is evident in the current design. AIXTRON is pleased to partner with United Silicon Carbide as they advance SiC materials into next generation devices."
Dr. John Hostetler, Director of Engineering at USCi, comments: "Having evaluated the market for SiC epitaxy equipment, and based upon our success with merchant SiC epitaxy vendors utilizing similar tools, we have selected the AIXTRON VP2400HW system for the superior quality of both n- and p-type SiC epitaxial layers. The versatility of the 2400 system will enable USCi to rapidly develop novel device designs. The system's ability to achieve high growth rates makes it an ideal platform to develop our next generation high voltage (5-15kV) SiC devices with thicknesses in excess of 100 microns. Aixtron planetary reactors are becoming the standard for high volume SiC device production and our ownership of a 2400 will greatly facilitate our production process transfer to our merchant epitaxial wafer partners."
United Silicon Carbide, inc. is a semiconductor company specializing in the development of high efficiency Silicon Carbide (SiC) devices including Schottky Barrier Diodes, JFETs, BJTs, Solid State Circuit Breakers, Power Modules, and Custom SiC integrated circuits. USCi technology and products enable affordable power efficiency in key markets that will drive the new and greener economy. These include: wind and solar power generation, energy storage, electrification of transportation, emerging Smartgrid technologies that are adding intelligence to our power grid, motor control, and numerous other applications that require higher efficiency, compact designs, and demanding thermal constraints.
