The µ-LAM technology (patent pending) uses a laser source coupled to a diamond cutting tool to thermally heat and soften hard and brittle materials rendering them more ductile, easier to machine (fabricate) and significantly reducing tool wear; all of which leads to higher productivity in the manufacturing process. The system in general consists of a fiber laser (typically near IR) that passes through an optically transparent diamond cutting tool and emerges at the interface (cutting edge) between the tool and work piece being machined (this is generally implemented in a lathe machine configuration for turning operations). The process is capable of machining nominally hard and brittle semiconductors and ceramics (such as Silicon & Silicon Carbide) in a ductile-plastic mode without brittle fracture and with minimal surface and sub surface damage. The µ-LAM system can be readily applied to precision conventional diamond turning machines to perform single point diamond turning (SPDT) of optical, mechanical components and semiconductor materials.
