Spun out of SUNY Polytechnic Institute, Lux Semiconductors is usefully understood as a microelectronics startup delivering advanced chip packaging for the next era of Moores Law. The firm is structured around development of thin-film semiconductors with a recrystallization process suitable for roll-to-roll manufacturing. The company's technology is structured around enabling the manufacture of flexible semiconductor substratess that can be used in solar panels and is suitable to host a range of electronic components and fully integrated system-on-chip designs including sensors, RF, displays, lighting, processors, memory, MEMS, and photovoltaics. To address the emerging needs of high bandwidth, low latency, and small size, the company has developed System-on-Foil (SoF), the first advanced chip packaging platform based on a metal substrate. The novel platform is designed for chiplet-based heterogeneous integration and will support applications like HPC, 5G/6G, AI, medical wearables, and gaming, among others. Lux has received over $6 million in grant and contract funding to advance System-on-Foil, including from the US Air Force, US Space Force, US Department of Energy, and National Science Founda
