This proposal covers the transition plan of the Navy developed high temperature packaging technology and the final R&D of the Phase I material characterization and packaging process along with the development of a commercial high temperature package manufacturing process into a commercial process. The transition plan includes in-depth research on the materials and the optimization of the commercial process. The package design for Phase II is still based on the NAWC design. The NAWC introduction of the package for their military hostile environment application has potential commercial applications and Phase II program will provide the first exposure of such package in microelectronic market. The Phase I was successfully completed in January, 1996. The Phase I packages were crack-free and hermetic. The Phase II program will establish a technique for reliable parts in moderately large quantities, and develop the market for them. Sensors such as pressure, temperature, gaseous or liquids applications for jet engines, geothermal, oil production, automotive, corrosive fluid measurement, nuclear energy, etc.
Keywords: Aluminum Nitride Aln High Temperature Package Microelctronical Package Ceramic Package Ceramic Cover
