This Small Business Innovation Research Phase I project focuses on the need to measure the thickness of thin films accurately and rapidly in the semiconductor industry. Currently, this is accomplished only in specialized laboratories using attachments to general purpose x-ray diffractometers. This approach requires highly skilled personnel and extremely lengthy experimental times. The objective of this research is to examine the feasibility and design of an Angular Dispersive X-Ray system to allow for rapid, routine measurement of the thickness of thin films. The research will consist of fixturing components into an angular dispersive configuration, measuring and evaluating data referenced to standards, and ascertaining accuracy and precision. The results of this process will be to finalize a design consistent with ease of operation, clean room compatibility and Sematech standards.
