Advanced Integrated CMOS Terahertz (THz) Focal Plane Arrays (FPA)
Award last edited on: 5/26/2023

Sponsored Program
Awarding Agency
Total Award Amount
Award Phase
Solicitation Topic Code
Principal Investigator
Esko O Mikkola

Company Information

Alphacore Inc

304 South Rockford Drive
Tempe, AZ 85281
   (480) 494-5618
Location: Single
Congr. District: 09
County: Maricopa

Phase I

Contract Number: N/A
Start Date: 9/22/2022    Completed: 9/21/2024
Phase I year
Phase I Amount
Direct to Phase II

Phase II

Contract Number: HM047622C0075
Start Date: 9/22/2022    Completed: 9/21/2024
Phase II year
Phase II Amount
Existing THz devices have not yet provided all the imaging functionalities required to fulfill non-destructive imaging and remote sensing applications. Most of the THz imaging and spectroscopy systems utilize single-pixel detectors, which results in a severe trade-off between the measurement time and field-of-view. Lack of large-format (many-pixel) sensor arrays is one of the major hurdles for the proliferation of THz sensing methodologies and related applications like medical imaging and security screening. In this Direct-to-Phase II program, the team will demonstrate a fieldable prototype THz-FPA meeting the required bandwidth (1-3 THz) and dynamic range (>30dB) for large-format (>1 kilo pixel) with at least 1fps. The FPA will be fully integrated on a single CMOS chip, including the antenna receivers, RF detectors and baseband detectors, and processing unit. The key technologies that will be optimized include the detector architecture and bandwidth, including continuous-wave and time-domain sensing alternatives using solid-state and photoconductive sensors, integrating the readout technologies into an ASIC, leveraging our existing read out integrated circuits (ROICs), detector to ROIC interface optimization and full system integration.