SBIR-STTR Award

Ultrapure, High Growth Rate Epitaxial Technologies for Gallium Nitride Ultra High Voltage Power Electronics
Award last edited on: 12/31/2019

Sponsored Program
SBIR
Awarding Agency
DOD : Navy
Total Award Amount
$1,151,597
Award Phase
2
Solicitation Topic Code
N182-134
Principal Investigator
Gary Hering

Company Information

Agnitron Technology Inc

6595 Edenvale Boulevard Suite 180
Eden Prairie, MN 55346
   (952) 937-7505
   sales@agnitron.com
   www.agnitron.com
Location: Single
Congr. District: 03
County: Hennepin

Phase I

Contract Number: N68335-18-C-0744
Start Date: 10/15/2018    Completed: 1/30/2020
Phase I year
2019
Phase I Amount
$124,986
Future DoD and Navy missions require advances in current high voltage power electronics technology. In this proposed effort, Agnitron will investigate the limitations of existing MOCVD technology and propose solutions towards an MOCVD system for Gallium Nitride capable of growth rates over 10um per hour at pressures from low to super atmospheric. The goal is to achieve low background concentrations under these conditions as well as demonstrate heavily doped p+ and n+ (Al)GaN layers <50nm thick. At the end of this program we will establish a plan for optimizing the growth process as well as reactor configuration to meet the objectives of the Phase I program.

Phase II

Contract Number: N68335-20-C-0105
Start Date: 12/30/2019    Completed: 12/31/2021
Phase II year
2020
Phase II Amount
$1,026,611
Future DoD and Navy missions require advances in current high voltage power electronics technology. In this proposed effort, Agnitron will investigate the limitations of existing MOCVD technology and propose solutions towards an MOCVD system for Gallium Nitride capable of growth rates over 10 um per hour while at the same time keeping the background impurity concentration to low 1015 cm-3 range. In the Phase II program, we propose to design and build a horizontal MOCVD reactor with multiple injection zones. The multi-injection zones will enable to match flow velocity and momentum across all points of gas injection in the growth chamber, preventing gas flow turbulence which affects film uniformity and growth rate. The reactor will be capable of operating from low to super-atmospheric pressure ranges. The goal is to achieve low background concentrations under these conditions as well as demonstrate heavily doped p+ and n+(Al)GaN layers.