Tessera proposes to repackage an existing BEAM radio in a miniature, lightweight form factor. Tessera would use state of the art advanced semiconductor packaging techniques developed by Tessera. A partner with an existing radio design would be selected and advanced 3D packaging technology would be applied to reduce the size and weight to approximately 20% of the existing radio while increasing the reliability and reducing cost. Tessera has contacted a BEAM radio maker about repackaging their existing radio. While an agreement has not been signed, both companies agree in principle on the benefit of such collaboration. The advantage to the Government would be to have a known working radio reduced in size, weight and cost with minimum schedule and minimum risk. Tessera proposes to analyze the radio and partition the functional sections such that miniaturized modules can be designed for each section. The modules will be combined to form the working radio. Tessera proposes to perform the mechanical, thermal, and electrical analysis on the modules. Phase I will result in a design, analysis and report on work completed. Should the Phase I option be granted, the additional funding would be used to complete the detailed design of integrated passive components.
Keywords: Chip Scale Packaging (Csp), Three Dimentional (3d) Semiconductor Packaging, System-In-Package (Sip), Miniature Bandwidth Efficient Advanced Modulation
