SBIR-STTR Award

Incorporation of cleavage microcracks on otherwise crack free material is a new approach used in the fabrication of some microelectronics devices. This proposal describes the development of a new computer controlled microindenter system for the fabrication of microcracks on a crystalline substrate. System capabilities will include the introduction of two simultaneous Vickers indentations at precise locations and close proximity, data acquisition of indentation load, penetration depth, and temperatures of the indenter head and the substrate, and the computer control of: 1) position of the substrate relative to the indenter head, 2) temperature of substrate and indenter head, and 3) the indentation loading rate.

The Portable/In-Situ Stress-Strain Microprobe (SSM) system can be used in measuring key mechanical properties of existing and new materials (e.g. metallic, ceramic, and composites) and in assessing the integrity of aging components and structures in the field (e.g. aircraft, pressure vessels, etc.). In the past few years, applications of the SSM were successful in testing metallic specimens and components at room temperature. In Phase I, we have extended the capability of the system to test ceramic materials and perform controlled microcrack propagation in single crystals (using a new double-Vickers diamond indenter in a single head). In Phase II, we intend to expand the modular capabilities of the SSM system to include: high temperature testing, evaluation of composites and fiber push-out, innovative optics, high resolution computer-controlled system for specimen-positioning, and to develo new testing procedures and analytical techniques for the use of different indenter geometries and to evaluate fatique damage and residual stresses from nondestructive indentation tests. A new computer-controlled microindenter system with the above modular capabilities will be delivered to the Navy with its comprehensive manual and a final report by the end of Phase II.