SBIR-STTR Award

High density electronic packing concepts
Award last edited on: 9/26/2002

Sponsored Program
SBIR
Awarding Agency
DOD : Navy
Total Award Amount
$46,082
Award Phase
1
Solicitation Topic Code
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Principal Investigator
Charles Rosen

Company Information

Microcom Corporation

965 Thomas Drive
Warminster, PA 18974
   (215) 672-6300
   ralph@conic.lmco.com
   www.l-3com.com
Location: Single
Congr. District: 01
County: Bucks

Phase I

Contract Number: N89-082
Start Date: 00/00/00    Completed: 00/00/00
Phase I year
1989
Phase I Amount
$46,082
Microcom proposes to study a very high speed (100 to 800 mbits/sec) data link which will sample and store parallel data and control inputs and transmit them serially to a remote destination where the information will be reassembled in original format. Thus a one medium link will replace high density multipin connectors. study will highlight environmental considerations and cost effectiveness

Keywords:
microcomputers electronic packing concept high density connectors data link data processing data man

Phase II

Contract Number: ----------
Start Date: 00/00/00    Completed: 00/00/00
Phase II year
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Phase II Amount
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