SBIR-STTR Award

A means towards the ability of directly attaching integrated circuits to printed circuit boards is proposed. Studies of the techniques used within the industry to fabricate integrated circuits are performed. The technology is adapted to permit the chips to be attached to printed circuit substrates with thermal and electrical properties that will permit chip survival. With the cooperation of wire bonding and laminate fabrication houses, a small number of actual circuits are to be fabricated to demonstrate feasibility.

This project proposes to develop the chip-on-board technology, wherein integrated circuit chips are attached to printed circuit substrates with thermal and electrical properties that will permit chip survival. The work plan will include a more extensive survey of the current technology, both domestic and abroad, thermal management and environmental protection studies, survey of substrate materials, building functional circuits, and stress and reliability testing and analysis. Upon completing the development of this technology, a small production line will be set up to begin commercial application of the technology.