SBIR-STTR Award

VORAGO Technologies will create a design for a radiation-hardened miniaturized System-In-Package (SIP) that will comprise of an ARM-Cortex based microcontroller, an MRAM memory chip and an Analog-to-digital converter. The significance of the innovation is to enable a highly integrated SIP assembly that integrates multiple die from different processes and foundries, enabling a miniaturized, highly-reliable embedded processing / sensor interface module. The SIP will be optimized for size, weight, power consumption and radiation hardness. Based upon preliminary calculations, we expect that the SIP will be a minimum of 5X the area of implementing discrete chips. Combining multiple functions together will significantly reduce the mass and volume compared to existing solutions that would require at least three separate ICs to provide the same level of functionality. Designers will be able to reduce their PCB size and the amount of effort that it takes to layout and route a board. Fewer PCB connections and solder joints will improve the reliability of a design. A single SIP can also be tested and qualified more expediently than three individual devices. The technical objectives for the SIP are to select best-in-class radiation hardened semiconductor devices that offer a high level of performance, interoperability, very low power consumption and produce a design to integrate them into a single package. The resulting package footprint will be the smallest possible but will be designed so that it can be tested and qualified to MIL-PRF-38534. There are two package configurations that are possible to implement. One option does not involve die stacking and will reduce the area (versus using three standalone chips) of 5.03X. Another option uses a stacked die configuration and will result in an area reduction of 7.37X. After analyzing out both options in more detail, we will decide which option to pursue. A test and qualification plan will be provided.

Potential NASA Commercial Applications:
(Limit 1500 characters, approximately 150 words) This board will be a suitable platform solution for many NASA space-based observatories, fly-by spacecraft, orbiters, landers and robotic / sample return missions that require robust command and control capabilities. This miniaturized SIP will be an ideal companion chip to locate with sensors (either analog or digital output types) to perform signal conditioning close to the sensing element. This is advantageous as signals are cleaner at the source without the electrical noise pollution that long signal paths introduce. The device is based upon a programmable microcontroller that is therefore flexible for many highly reliable embedded processing or sensor readout application. When software is programmed into the device, it becomes a custom solution. Programming the device and supporting software will be straightforward as it based on an existing ARM Cortex architecture.

Potential NON-NASA Commercial Applications:
(Limit 1500 characters, approximately 150 words) There is a demand for a highly integrated SIP like this in commercial space applications, particularly satellites. The benefit of this part over closest fit existing solutions is that there are no state-of-the-art (based on ARM Cortex) "mid-range" embedded processors that are available in a small footprint with NVM and a precision analog-to-digital convertor. Commercial space system developers that would have an interest in this SIP would include SpaceX, Tyvak, SSTL, SSL, Spire, Pumpkin, Planet Labs, Planetary Resources, GomSpace, Clyde Space, Innovative Solutions in Space, Boeing, Astranis and Raytheon.

Technology Taxonomy Mapping:
(NASA's technology taxonomy has been developed by the SBIR-STTR program to disseminate awareness of proposed and awarded R/R&D in the agency. It is a listing of over 100 technologies, sorted into broad categories, of interest to NASA.) Algorithms/Control Software & Systems (see also Autonomous Systems) Autonomous Control (see also Control & Monitoring) Avionics (see also Control and Monitoring) Circuits (including ICs; for specific applications, see e.g., Communications, Networking & Signal Transport; Control & Monitoring, Sensors) Command & Control Condition Monitoring (see also Sensors) Process Monitoring & Control Robotics (see also Control & Monitoring; Sensors) Sensor Nodes & Webs (see also Communications, Networking & Signal Transport) Spacecraft Instrumentation & Astrionics (see also Communications; Control & Monitoring; Information Systems)

VORAGO Technologies has created a product design and MIL-PRF-38534 qualification plan for a radiation-hardened miniaturized System-In-Package (SIP) that comprises an ARM® Cortex®-M0 microcontroller (VORAGO VA10820), a 16-channel 14-bit analog-to-digital converter (Cobham RHD5950) and a 2Mbit FRAM (Cypress CYRS15B102). All the design work and planning has been put in place to produce working packaged SIP devices and qualify them in phase II.Each of the three rad-hard die will be mounted on substrate within a hermetic 68-pin ceramic package. Individual signals from each device are routed via the substrate within the chip, which also includes decoupling capacitors and pull-up resistors in the SIP. This optimizes the number of useful pins that are available to the system designer.The SIP design optimizes the size, user simplicity and reliability of the solution. Using this SIP solution rather than three discretely packaged parts means that the area of the functionality can be reduced by approximately a factor of five and the number of pin interconnections on a PCB can be reduced by a factor of more than three.In phase II, we propose to build 85 units of the device and qualify it. In addition, we will build evaluation boards and a software board support package so that the device can be easily evaluated and used for development work by NASA engineers. Our objective is to get as many units / evaluation boards onto NASA engineers desks as possible.We have discussed this device with NASA engineers from GSFC, Ames, JPL, JSC and MSFC and have received very positive feedback that the SIP device would be useful to them and would help simplify and miniaturize their electronics designs. Comments from NASA engineers have been included in the Phase II Technical Proposal.

Potential NASA Commercial Applications:
(Limit 1500 characters, approximately 150 words) In general, the SIP device will be a suitable solution for many NASA space-based observatories, fly-by spacecraft, orbiters, landers and robotic / sample return missions that require robust command and control capabilities. The SIP will be used in payload and C & DH functions and low speed telemetry systems. Typical applications of the SIP will be:-Low power, small form factor interface for sensors and actuators-Motor controller processor-Power supply monitor and power sequencer-Embedded control housekeeping processor-Safety monitor / watchdog device-Analog signal interface with digital serial communications outputAn example application for programming the SIP to become a fixed-function device would be for VORAGO to program firmware into the device to operate as a power sequencing chip that can be used to bring up multiple power supply voltage rails in the required sequence and in conformance with the start-up timing requirements of the system. This would ensure that a system using multiple supply voltages booted up correctly. There is currently no radiation hardened power sequencer chip available that can provide power sequencing of this nature for up to sixteen independent voltage rails.



Potential NON-NASA Commercial Applications:
:
(Limit 1500 characters, approximately 150 words) We can confidently claim that there will be a lot of interest in this device from commercial space companies. We know this to be true because VORAGO have experience in selling the VA10820 microcontroller since 2015. We have had regular feedback from many sources that the addition of an analog-to-digital convertor and non-volatile memory would be very attractive to reduce the PCB size and increase functionality. The SIP device addresses this feedback squarely.There is a demand for a highly-integrated SIP like this in commercial space applications, particularly C & DH for interfacing to analog signals with digital interfaces and programmable control functionality. The benefit of this part over closest fit existing solutions is that there are no state-of-the-art (based on ARM Cortex) ?mid-range? embedded processors that are available in a small footprint with NVM and a precision analog-to-digital convertor. Commercial space system developers that would have an interest in this SIP would include Ball Aerospace, Bigelow, Blue Canyon, Boeing, Busek, Tyvak, SSL, Millenium, Lockheed Martin, Moog Northrop Grumman, Planetary Resources, UTC, and Raytheon.Other commercial non-NASA applications that could use the SIP would be in C & DH and payload applications in CubeSats and Smallsats.

Technology Taxonomy Mapping:
(NASA's technology taxonomy has been developed by the SBIR-STTR program to disseminate awareness of proposed and awarded R/R&D in the agency. It is a listing of over 100 technologies, sorted into broad categories, of interest to NASA.) Avionics (see also Control and Monitoring) Circuits (including ICs; for specific applications, see e.g., Communications, Networking & Signal Transport; Control & Monitoring, Sensors) Command & Control Data Acquisition (see also Sensors) Data Processing Navigation & Guidance Robotics (see also Control & Monitoring; Sensors) Sensor Nodes & Webs (see also Communications, Networking & Signal Transport) Spacecraft Instrumentation & Astrionics (see also Communications; Control & Monitoring; Information Systems)