One of the main difficulties in the preparation of backside-illuminated CCDs is making electrical connection to the front of the device. A simple and reliable solution to this problem could increase the yield and lower the cost of thinned CCDs. A new packaging technique, referred to as Double Inverted Bonding (DIB), appears to be a promising solution. The DIB technique will be optimized by evaluation of materials for the adhesive layer and substrate and tested for reliability by electrical continuity measurements during thermal cycling. The optimized procedure will be applied to a functioning, thinned CCD at the end of Phase I. The DIB technique could greatly simplify the packaging of commercial, backside illuminated CCDs.The DIB technique would find use in the packaging of thinned CCDs and photodiode arrays.
