Copper-graphite composite is proposed for a thin liquid-cooled cold plate for high density electronic thermal management. The proposed cold plate will have CTE in the range of 2~9x10-6 /°C to match those of semiconductors such as SiC, silicon, GaAs, as well as ceramic substrates. The composites have a thermal conductivity of ~200 W/m K in the through-plane direction and ~300 W/m K in planar directions. The proposed cold plate will be able to withstand temperatures up to those of copper-silver brazing (780 degree C) for subsequent die attachment or substrate bonding, without re-melting the brazing joint.
Keywords: Thermal Management, Radar, Liquid Cooling, Heat Sink, T/R Module; Hpa; Wide Band Gap; High Voltage Gaas