In this proposal, INTRINSIC Semiconductor proposes unique and innovative semi-insulating (SI) SiC substrate process technologies that will impact next generation GaN and SiC device development, leading to innovative radar and RF discreet and monolithic microwave integrated circuit (MMIC) products. The technical objectives and the approaches to be pursued in this Phase I program are targeted for SI SiC manufacturing cost reduction via increased boule length (>30 mm) and bulk growth rate (> 1mm/hr)