SBIR-STTR Award

A System for the Thermal Control of Integrated Circuits
Award last edited on: 4/8/2014

Sponsored Program
SBIR
Awarding Agency
DOD : MDA
Total Award Amount
$815,000
Award Phase
2
Solicitation Topic Code
-----

Principal Investigator
Roger Bane

Company Information

Cox Technologies (AKA: Wolfbane Technologies)

69 McAdenville Road
Belmont, NC 28012
   (704) 825-8146
   N/A
   www.coxtec.com
Location: Multiple
Congr. District: 10
County: Gaston

Phase I

Contract Number: N/A
Start Date: 00/00/00    Completed: 00/00/00
Phase I year
1999
Phase I Amount
$65,000
A system is designed to protect integrated circuits and other electronics from excessive temperatures. The system will allow the use of electronics devices with greater heat dissipation requirements while at the same time preventing damage or dysfunction of the devices if their local temperature exceeds the recommended operating temperature. The design is applicable to a wide variety of electronic systems including standard computer motherboards and high density multi-chip modules (MCMs). It is directly applicable to existing commercial systems with a minimum of engineering changes. The system will add less than 0.1 cubic inches of new material to the electronics package. Further proprietary technical details are given in a "Proprietary Technical Brief" at the top of page 3. Anticipated Benefits and

Potential Commercial Applications:
The system will allow the operation of faster electronics and those that produce a significantly larger thermal load. This will effect all high speed microprocessors and most computer systems. The commercial benefits of faster electronics are great.

Phase II

Contract Number: N/A
Start Date: 00/00/00    Completed: 00/00/00
Phase II year
2000
Phase II Amount
$750,000
___(NOTE: Note: no official Abstract exists of this Phase II projects. Abstract is modified by idi from relevant Phase I data. The specific Phase II work statement and objectives may differ)___ A system is designed to protect integrated circuits and other electronics from excessive temperatures. The system will allow the use of electronics devices with greater heat dissipation requirements while at the same time preventing damage or dysfunction of the devices if their local temperature exceeds the recommended operating temperature. The design is applicable to a wide variety of electronic systems including standard computer motherboards and high density multi-chip modules (MCMs). It is directly applicable to existing commercial systems with a minimum of engineering changes. The system will add less than 0.1 cubic inches of new material to the electronics package. Further proprietary technical details are given in a "Proprietary Technical Brief" at the top of page 3. Anticipated Benefits and

Potential Commercial Applications:
The system will allow the operation of faster electronics and those that produce a significantly larger thermal load. This will effect all high speed microprocessors and most computer systems. The commercial benefits of faster electronics are great.