Multilayer ceramic capacitors (MLCCs) are the most reliable source of high-energy density storage banks. They also find use in high frequency switch mode power supplies because they are optimized to minimize both effective series resistance (ESR) and effective series inductance (ESL). The demand for multilayer ceramic capacitors having high capacitance and high volumetric efficiencies is leading the challenges in the Manufacturing of MDCCs. Proposed here I-, a development by physical vapor deposition (PVD) technique of low cost and high efficiency aultilayer ceramic capacitor chips (KLC3s) based on insulating boron nitride thin layers and conductive copper or aluminum compatible inner electrodes. PVD of these hybrid materials offer many potential advantages because their structures can be controlled at the near-atomic level. The fabrication of this new designer materials using multilayer micro-structured technology extends the use of ceramic capacitors to a wider range of temperatures and increases their energy density several order of magnitude over present technology, with significant advantages. Large matrices of multilayer ceramic capacitors will be fabricated using different patterns for electrodes and dielectric thin films templates. We will also demonstrate the merits of BN-based MlC3s for use in space specific for device applications.
Keywords: Multilayer Ceramic Capacitors, Boron Nitride, Monolithic Physical Vapor Deposition, High Energy
