Wireless portable communications is a multi-billion dollar industry that demands ever-faster and smaller cellular devices. The heart of theses devices is the multi-chip module (MCM) which connects the electrical communication components to another, and governs both the speed of communication signals between the components and the size of the portable device. Futrure generations of portable devices require smaller and faster MCMs to meet customer demands. However, the problem of crosstalk between metalization lines develops when the size of the MCM is decreased. This can be minimized by reducing the dielecric constant of the dielecric layers in the MCM substrate. The best way to reduce the dieelctric constant is by adding holllow microspheres which add controlled porosity to dielectric layers of the MCM. Nanochem has a process which can supply alumina microspheres with sizes ranging from 1 to 3 microns and have dense thin-walled shells which are impermeable to water and oil absorption. Optimum conditions will be determined to formt he hollow microspheres. These optimum microspheres will be tested in MCM devices and tested for dielectric properties.
Keywords: Multi-Chip Modules (Mcms); Wireless Portable Communication; Hollow Microspheres; Dielectric Constant
