Aluminum Nitride (AlN) substrates are attractive for III-nitride epitaxial growth due to their high thermal conductivity, close lattice and thermal expansion match to III-nitride compositions used for opto-electronic and electronic devices and their relative ease of growth when compared to Gallium Nitride (GaN). A comprehensive program which integrates the manufacturing of starting material feedstock, single crystal growth and wafering process development. The overall program objective is to develop a process for synthesizing high purity, consistent AlN powder for use a feedstock for the sublimation growth of single crystals. Seeded AlN single crystal growth using a unique vertical furnace provided through DURIP will be used to study the impact of crucible material and design on crystal growth and quality. Crystal slicing and polishing processes will be developed to prepare the substrates for epitaxial growth. Initial studies will be carried out in Phase I which will establish the basis for the Phase II crystal growth technology transfer from Kansas State University to American Xtal Technology. In Phase III AXT will fully commercialize AlN substrate technology. We have proposed a unique program which integrates all aspects of technology which are required to achieve a commercially viable AlN substrate manufacturing process. Successful development of a large-area, high-quality AlN substrate will have significant impact on the development and availability of blue and green III nitride lasers and nitride-based high temperature, high power electronics. Conservative estimates of the potential market for these devices is in the billions of dollars within the next 5-10 years. The devices are important for many military and commercial applications such as high density data storage, solar-blind detectors, high resolution printing, underwater communications, etc.
Keywords: Powder-Synthesis, Aluminum-Nitride, Single-Crystal, Sublimation, Aln, High-Yield, Wafer-Process, Lar