SBIR-STTR Award

A Novel Thermal Management Method for SiC Power Electronics
Award last edited on: 4/28/2006

Sponsored Program
SBIR
Awarding Agency
DOE
Total Award Amount
$99,955
Award Phase
1
Solicitation Topic Code
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Principal Investigator
John Lawler

Company Information

Advanced Thermal and Environmental Concepts (AKA: ATEC Inc~Advanced Thermal Environmental Concepts~ Advanced Thermal Engineering)

7100 Baltimore Avenue Suite 300
College Park, MD 21044
   (301) 699-1023
   N/A
   www.atec-ahx.com
Location: Single
Congr. District: 04
County: Howard

Phase I

Contract Number: ----------
Start Date: ----    Completed: ----
Phase I year
2005
Phase I Amount
$99,955
Although solid-state power modules are becoming increasily important components in energy systems (e.g., wind turbines) and in vehicle propulsion systems (e.g., hybrid vehicles), the requirements for these power modules are beginning to exceed the limits of silicon-based power modules. Therefore, a switch to silicon carbide power modules, which can operate at higher operating temperatures and higher power loads, is critical to the deployment of many of these energy and vehicle systems. However, in order to take full advantage of the higher performance of silicon carbide power modules, new packaging and thermal management schemes will be required. This project will develop a novel packaging approach for silicon carbide power modules, which will not only improve thermal management but also allow the production of smaller, higher current, higher frequency power modules. By eliminating many of the interfacial layers currently used in silicon power modules, the approach also will improve manufacturing yield and operating reliability. In Phase I, the feasibility of the packaging concept will be demonstrated by assembling a silicon carbide die-ceramic cold plate, measuring its thermal resistance, and monitoring its thermal behavior during thermal cycling of the package. In Phase II, a complete silicon carbide power module, employing the new packaging will be fabricated and tested.

Commercial Applications and Other Benefits as described by the awardee:
The largest short-term commercial market is in the packaging of emerging SiC power modules. In addition major potential markets for power electronics include variable speed motor drives for hybrid vehicles ($12 billion annually), uninterruptible power suppliers ($5 billion annually), power supplies for computers and instruments ($11 billion annually), and distributed power (which includes inverters for photovoltaic and fuel cells, engine generator sets, wind and hydro turbines, welding power suppliers, industrial power supplies for metal and glass plating and coating; and lighting ballasts)

Phase II

Contract Number: ----------
Start Date: ----    Completed: ----
Phase II year
----
Phase II Amount
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