This project investigates the development ofthermopile-based infrared imagers using silicon integrated circuittechnology and state-of-the-art micromachining. The devices shouldpermit the remote monitoring of temperature and temperatureuniformity in furnaces and other process facilities for whichcontact measurements are not possible. The project also providesthe key element in advanced thermal sensing systems capable ofautomatic compensation for device offsets and nonlinearities aswell as object emissivity variations. Building on researchperformed at the University of Michigan, the work focuses ontransferring that technology to a commercial product. In Phase Iof this project, the University's previous research vehicle-a32-element linear imager-is being redesigned to make it morecompatible with foundry fabrication and to optimize it further forspecific applications. Micromachining capabilities are beinginstalled so that eventual production wafers, when returned fromthe foundry, can be etched in-house as the final step in theprocess to create the finished imagers. In addition, a packagethat preserves the high performance of the detector, and isconsistent with high production volumes at low cost, is beingdeveloped. Finally, prototype arrays fabricated at the Universityare being tested to determine their performance. Phase II wouldinitiate imager wafer fabrication at a commercial foundry andexplore practical wafer performance and yield in high volumes. Itwould also investigate full area arrays based on this technology.Anticipated Results/Potential Commercial Applications as described by the awardee:The resulting devices should be useful for avariety of applications in infrared sensing and thermography,including horizon sensing, weld tracking, remote temperaturemeasurement for automated process control, noncontact radiometry,and fire sensing in buildings and vehicles. The devices would alsobe attractive for use in many consumer products, e.g., photocopyingmachines, intrusion alarms, and many appliances.
