SBIR-STTR Award

We will demonstrate penetrating peripheral recording and stimulating devices using engineered low cure stress softening polymer substrates. Polymers can be implanted at moduli of more than 1 GPa and soften toward the modulus of tissue. Neural interfaces allow for delivery of a large amount of information, but current microstimulators or microrecorders fail chronically or are poorly suited for interfacing with small biological structures, such as sensory peripheral nerves. We discuss chronic device failure through design of both materials and devices to overcome various failure mechanisms. We demonstrate the effects of softening vagus nerve interfaces and penetrating, coiling cochlear implants. We will demonstrate spinal stimulators that reduce inflammation and tissue response and behave in a manner similar to ball electrodes for use in understanding long-term muscle plasticity. We demonstrate softening peripheral neural interfaces for modulating sensory and motor input toward closed-loop feedback for prosthetics. We will support the neuroscience research community and the wounded warrior with devices toward future clinical work based on this feasibility study.

The main objective of this Phase II.2 DARPA SBIR proposal is to develop a robust and reliable electrical connection strategy for softening implantable electrode arrays and industry standard connectors for use in chronic animal models at research facilities throughout the world.The Phase II.2 base period consists of two tasks: 1) to connect softening neural interfaces to wire-based and flexible polymer cables using novel conductive adhesives, and 2) to use traditional microfabrication techniques with morphing polymers to create strain-tolerant cabling structures. In both tasks, we will test the robustness of these electrical connections in response to mechanical cycling under physiologic conditions as well as under accelerated aging and prepare the resulting devices for sale to the research neuroscience community at large. This DARPA Phase II.2 project will enable interconnect and cabling strategies that will not only impact the success of softening bioelectronics devices, but also create a new cabling solution for a variety of device architectures supplied by other companies. Led by Qualia, this proposal leverages expertise in biomaterials and neural engineering from the University of Texas at Dallas.