SBIR-STTR Award

Tessera, Inc. will design a miniature Command and Data Handling (C&DH) subsystem module for use in nanosatellites. Working with requirements information supplied by nanosatellite systems experts, Tessera will apply stacked chip scale package (CSP) and system-in-a-package (SiP) designs to C&DH digital components to produce a module design for a very small, very dense C&DH digital subsystem building block that is flexible to be deployed to support a range of nanosatellite configurations. The module will significantly reduce complexity of the CD&H system, and hence demonstrate a highly effective approach to making nanosatellites more productive and cost-efficient. Package substrate designs for chip scale packages for the core subsystem components will be detailed. A SiP module substrate will be designed to accept and connect the component chip scale packages and provide interconnect to nanosatellite systems. The designs will be optimized using physical, electrical and thermal performance simulation modeling software. Tessera will develop cost estimates for the module using substrate and chip cost quotes from suppliers based on the package and module designs and manufacturing costs using an industry verified cost model.

The goal of the Tessera’s Phase II work proposed here is to demonstrate the effectiveness of advanced packaging technology for miniaturizing a nanosatellite C&DH sub-system. The key objectives along the path to this goal are

Keywords:
Miniaturization, Nanosatellite, Command And Data Handling, C&Dh, Packaging, System-In-Package, Sip