SBIR-STTR Award

R3 Logic, Incorporated proposes to perform a comprehensive study to develop a full suite of computer-aided design tools for three-dimensional circuit integration. The company will build on its existing tool set that enables 3-D physical layout and verification and will develop recommendations for extending these tools to permit analyses of 3-D circuit performance, including thermal and electromagnetic effects, to perform automated place and route, and to interface with automated tools for top-down design and circuit synthesis from behavioral models. The proposed study will focus on methodology and algorithmic development. In Phase II we will propose to implement the recommendations of this study. The development of a powerful set of 3-D design and modeling tools is critical to promoting the advancement of three-dimensional circuit technology in the semiconductor industry. 3-D circuits cannot be implemented without a 3-D process technology; and 3-D process technologies will not be available until there are overwhelmingly convincing reasons to put them in place. The major benefit of developing modeling tools for 3-D circuit performance will be in providing quantitative demonstrations of the improvements achievable through multi-layer stacking and vertical interconnection. It will also ease the transition of VLSI designers into a 3-D world by providing examples of existing circuits optimized for 3-D.

Keywords:
3-D Integration, Electronic Design Automation, Computer-Aided Design Tools, Parasitic Extraction, Thermal Modeling, Top-Down Design

R3 Logic proposes to develop an openly accessible Design Environment that will incorporate CAD tools needed for the analysis and design of 3D integrated circuits, including schematic capture, VHDL interfaces, 3D physical layout, verification, 3D parasitic extraction, interactive coupled electro-thermal simulations, and thermally-aware place and route methods. We will achieve this goal, first by building upon prior tools developed by the company for physical layout and verification; and second by making it possible for others to contribute code to the environment. We will develop a unified methodology for interfacing new modules to the system and enforce modern software engineering best practices. During the program, we will provide direct support to DARPA VISA program participants to help them use the tools, and will use their feedback to improve the system. Following this program, we will make the 3D Design Environment universally accessible to anyone interested through a high-bandwidth web site, which the c

Keywords:
CAD TOOLS, 3D INTEGRATED CIRCUITS, PHYSICAL DESIGN, EDAompany will maintain.