Act, Inc. is requesting a Phase I grant to partially fund the costs of developing a deep ultraviolet (UV-2) pellicle material and process for producing prototype pellicle films for evaluation in the imaging step of advanced integrated circuit fabrication. Pellicles are thin free standing transparent films that protect the photomask from airborne contamination which can result in catstrophic printed defects on the silicon wafer during pattern transfer from the mask. The material development is based on previous work (4), (9) performed by the principal investigator in this area as well as polymer structure considerations relating to optical film transmission in the UV-2 wavelength region. Selected polymer candidates will be tested and films analyzed in act's existing class 100 pelicle clean room laboratory at its BFTC location. Also during Phase I, the process for producing free standing pellicle films suitable for UV-2 applications from a spin-castable liquid formulation will be developed and optimized for the selected material. Rudiments of this process are known from previous work of the principal investigator. Final suitabiity of the prepared pellicle film for deep UV. Microlithography and laser applications will be determined from actual exposure tool and laser optical bench tests as well as film optical transmissions as obtained on a scanning UV-visible spectrometer such as a Perkin Elmer Lambda-3 or Bausch & Lomb Spectronic 2000. Anticipated benefits/potential commercial applications - successful development of the UV-2 pellicle film and film forming process will result in the construction of a manufacturing facility at a cost of $500,000. The facility will be built in conjunction with act's partner company (i.e., Confidential negotiation in progress) to provide production grade pellicles for IBM and the domestic need which presently is approximately 200,000 films per year (i.e., Deep UV, UV-3 and UV-4 films).
