SBIR-STTR Award

IJ Research, Inc. proposes to develop a high temperature integrated power packaging system for Hybrid Electric Drive Propulsion Systems. Itincludes a hybrid MCM package housing a 6-switch bridge IGBT inverterand a integrated low-cost microchannel heat sink into the package body. Advanced ceramics and composites are selected for the packaging system for the miniaturization, weight and cost saving. The proposed microchannel heat sink uses water ethylene glycol coolant such that the existing engine cooling system on the vehicle can be utilized to providethe coolant circulation. This integrated design is aimed to save the weight and volume of this packaging system to the maximum extent to meet the current Future Combat System requirements. The cost of the proposed microchannel heat sink is estimated to be a very small fraction of the LLNL microgroove heat sinks based on the selected material and fabrication technique. The thermal resistance of the heat sink will be at the level of 0.02 degrees Celsius/(W/cm2). The dual purpose design enables this packaging system to be used both for the silicon devices at the power rating of 750 hp 3-phase AC and for the future SiC devices at 1500 hp and hither.

Benefits:
Power conditioning packaging systems based on this proposal could be used in civilian and military electric drive vehicles. A series of derivatives of this packaging system could be used in a large number of electric motor controls. High interest on this technology has been drawn from power electronic manufacturers. Rapid commercialization of this technology is extremely likely.

The proposed R & D is the Phase II technical development of high power and high power density packaging for high power MCM and integrated 3D network microchannel heat sink using dvanced mateials of AlN and Al/SiC MMC composite. The proposed 3D network microchannel heat sink will demonstrate the important characteristics of low thermal resistance (as low as 0.02 W/cm2) and low hydraulic pressure drop (below 40 psi). It is intended to utlize and integrate the existing vehicle engine coolant so that the the cooling system can be simpler with a light weight and less space taken up by the system. With this proposed desgin, there will be a cost saving in fabrication and operation. These packages will be used with either Si, SiC and/or the mix of these two devices. A finite element analysis technique will be extensively used for various simulations of heat transfer, fluid flow and temperature distributions as well as the thermal stress in the package.

Keywords:
High Power Electronic Package,High Temperature Package,Integrated Power Module,Hybrid Ceramic Package, Microchannel Heat Sink, Low Thermal Res