There are many inspection and verifications processes, the performance of which would enhance the reliability of microelectronic assemblies, that can not be performed with a single sensor modality. Acuity has demonstrated in a Phase I proof of concept study how multi-sensor fusion using a combination of 2D visible light, 3D range sensing and microfocus x-ray can enhance inspection of solder joints. The Phase I study also identified application areas in current processes, such as solder paste and adhesive volume measurement, and in emerging processes such as BGA, Chip on Board, MCM, and specialized packaging involving flex circuits and minimally packaged die, where multi-sensor based inspection will be either an enabling technology or a means for enhanced process yield and control. In performing the proof of concept study Acuity has identified the critical functionality of multi-sensor based inspection system and have produced an outline design for a practical system, The proposed Phase II effort will consist of identification of the particular requirements of the potential application domains, design and implementation of a practical prototype multi-sensor inspection system and testing and demonstration of the system prior to its delivery to government facility.
Benefits: In addition to expected use in critical defense and commercial electronic manufacturing applications the proposed systems have very significant commercial potential in the semiconductor, electronics, automotive, pharmaceuticals, medical devices, packaging/containers, discrete parts, and consumer goods industries.