The objective of this proposal is to develop and implement a scientifically based solderability tester as a process control tool during the fabrication process for printed circuit boards. Using the sequential electrochemical reduction analysis (SERA) process as invented by Rockwell International, data will be gathered to correlate the coulomb density values determined by SERA to current, commercial solderability testing as described in IPC-5-804. Designed experimentation methods will be used to determine the key process characteristics that can be controled as a result of the information available through the SERA test method. In addition, the SERA test equipment will be evaluated for its ability to withstand the normal production environment and possible design improvement recommendations will be made to enhance its ability to withstand the environment.
Keywords: Solderability, Weak Knee
