SBIR-STTR Award

Microstructural engineered thin film materials
Award last edited on: 3/23/2007

Sponsored Program
SBIR
Awarding Agency
DOD : Army
Total Award Amount
$461,290
Award Phase
2
Solicitation Topic Code
A90-326
Principal Investigator
William J Biter

Company Information

Damaskos Inc

PO Box 469
Chadds Ford, PA 19317
   (610) 358-0200
   info@damaskosinc.com
   www.damaskosinc.com
Location: Single
Congr. District: 05
County: Delaware

Phase I

Contract Number: DAAL02-91-C-0023
Start Date: 1/24/1991    Completed: 7/1/1991
Phase I year
1990
Phase I Amount
$49,387
damasko, inc. proposes to develop a thin film shielding material which will have properties combining the desirable features of good conductor and a highly magnetic metal. the film will be deposited onto a flexible substrate which will allow it to be laminated to form a composite material with good structural properties. this will result in a lightweight structure which can be made in complex shapes by low cost molding and lamination techniques. the magnetic film, including the substrate, will be thin and can be patterned. by bonding the film to a transparent support, a magnetic shielding material will be obtained which is essentially transparent

Phase II

Contract Number: DAAL02-92-C-0022
Start Date: 2/24/1992    Completed: 2/24/1994
Phase II year
1992
Phase II Amount
$411,903
Damaskos, Inc. proposes to continue development and commercialization of an advanced thin film shielding system which appears capable of meeting both the magnetic field and low frequency performance for EMP requirements while being able to retrofit existing structures. During the Phase I program, Damaskos, Inc. successfully demonstrated a composite material formed by depositing alternating layers of conducting and magnetic films without affecting their basic properties. This process produces a composite film with attenuation superior to either material separately. The composite material is deposited onto a flexible substrate using thin film processes. These sheets can be interconnected by soldering, insuring a good contact for both electrical magnetic fields. The flexible substrate minimizes problems with cracking due to building settling, etc. The Phase II program will address production problems associated with the material from the standpoint of cost and performance so at the end of the Phase 11 a viable product will result even at low initial production volumes. Larger production volume and the resulting lower cost will result in a broader market, including its use in TEMPEST applications and shielding to meet FCC requirements for commercial and consumer devices.