The project will develop a novel miniature pulse width modulated power driver for actuators, I.E. Dc motor. The power driver will deliver 50 at 50vdo in a double inon package. This compact design can only be achieved through the innovative combination of modern power semiconductor technologies, proprietary circuit design, and state-of-the-art packaging technology which utilizes new heat conductive potting materials. The research will provide tools to accurately predict the total circuit efficiency for deferent types of suitable power semiconductors. The circuit designs will be analyzed with CAE technology to prevent internal device stresses due to incorrect pre-drive signals and thermal stress in the junction areas. A full feature proof of concept prototype will result from this analysis, including verification of final package size and budgetary price information.
