Universal voltronics corporation (UVC) is proposing to attack the fundamental choke point (heat transfer) that presently precludes further miniaturization of power conditioning equipment in the one to 20kw range. Rather than follow the traditional route of immersing components in a coolant, UVC proposes to integrate the coolant into the components (e.g. Impregnate capacitors with fluorinert fluid, strip the covers off semiconductor junctions so fluid can contact the junction surface, etc.). This is expected to produce gains of two to five in power density (watts per lb.).
