Current technology does not allow sensors with leads (such as thermocouple) within a part or bondline because the leads cause unacceptable flaws. AvPro/TSI have developed the capability, in prior work, to obtain temperature readings from within a laminate or bondline without leads using an antenna one inch from the sensor. This is achieved using a magnetic field that activates an amorphous microwire sensor that changes its response as a function of temperature. They have also demonstrated, in Phase I SBIR research, that a read range of six inches is feasible. The sensor itself is approximately ten thousandths of an inch in diameter and one inch in length, which is below the detection level of standard nondestructive test methods and therefore below critical flaw size for most applications. The purpose of Phase II research is to demonstrate the range, reliability, precision, and accuracy of the remote temperature measurement and to verify with mechanical test data that the microwire sensor does not, in fact, cause mechanical degradation of the part or bondline. AvPro is collaborating with Northrop Grumman to test effect of the sensor on mechanical properties in an actual part and to demonstrate a Manufacturing Readiness Level of seven (MRL7).