Hypersonic flight environments can include vibration with high frequency spectral content that is difficult to simulate.This high frequency vibration may adversely affect the accuracy of guidance and control sensors, so it is very important to the Air Force Research Laboratory to be able to recreate the vibration in a way that allows sensor performance to be evaluated.Motion platforms such as the KHILS ISTAT facility have been built for this purpose, but current technology only partially addresses this need.Present frequency capability is limited to about 500 Hz, while 1000 Hz bandwidth would ideally be available.Dynamic Structures and Materials (DSM) believes that these needs can be met through a high frequency motion simulator that uses a parallel kinematic actuator (PKA).High performance linear motors will be used with a novel approach to construction of the joints to provide high performance, reliable motion simulation.This actuator will be combined with a flexible, open control architecture and high resolution sensors, resulting in a system that is maintainable and able to deliver the high acceleration and precision necessary for hypersonic flight vibration simulation.;
Benefit: The most direct benefit of the proposed development effort is improved fidelity in hardware-in-the-loop simulations at the KHILS facility.This will lead to better accuracy and more confidence in the performance estimates for US interceptors and similar hypersonic vehicles.After successful deployment at KHILS, there will be other opportunities to apply this technology.There are other flight simulation facilities such as the ones at USAF AEDC that might benefit from a similar capability.While remaining compliant with ITAR and other restrictions on distribution, DSM will seek to market related products for high performance vehicle simulation; this is a well-developed industry that would benefit from the increased capability described.Hexapods have many applications outside vehicle simulation, so it may also be feasible to market similar devices for wire bonders or similar high speed assembly applications.
