SBIR-STTR Award

Phase I tasks will produce a full-duplex, multi-channel, S-band transmit-receive (T/R) module design and the associated panel structure for integration into large communication phased array antennas. An RF section featuring advanced, two-chip Monolithic Microwave Integrated Circuit (MMIC) technology will replace the large number of discrete RF components in existing systems and an integrated command microcontroller will provide internal protection and built-in test capability. Design of the module will include interconnection and distribution circuits as well as the mechanical and thermal configuration. The anticipated advantages of this approach are size, weight, and cost reductions and maximized manufacturability, reproducibility, flexibility, and ease of replacement. Initial small- and large-signal simulations using foundry design kit models with associated layouts have been incorporated into the receive (Rx) and transmit (Tx) MMIC simulations presented in the proposal to show the feasibility of this approach. In Phase I, the design will be completed including electromagnetic simulations to account for parasitic coupling and to optimize performance and circuit integration. The module capability will be verified in Phase II with prototype fabrication and demonstration in a scalable 4x4 sub-array of a module supporting full-duplex, multiple simultaneous communication links.

Benefit:
This technology is applicable to military and commercial communication and radar systems. Commercial application: High performance, affordable, satellite and mobile communications.

Keywords:
Mmic, Power Amplifier, Low Noise Amplifier, Phase Shifter, Microcontroller, Multi-Channel Transmit-Receive Module, Phased Array Antenna, S-Band

Phase II tasks will produce a full-duplex, multi-channel, S-band transmit-receive (T/R) module for integration into large communication phased array antennas. An RF section featuring advanced, two-chip Monolithic Microwave Integrated Circuit (MMIC) technology will replace the large number of discrete radio frequency (RF) components in existing systems. An embedded command microcontroller will provide internal protection and built-in test capability as well as serial-to-parallel command conversion. Design of the module will include interconnection and distribution circuits as well as the mechanical and thermal configurations. The anticipated advantages of this approach are size, weight, and cost reductions and maximized manufacturability, reproducibility, flexibility, and ease of replacement. In Phase I, the MMICs were designed to predict performance capability and circuit integration. The module capability will be demonstrated and evaluated in Phase II with prototype fabrication, assembly, and testing.

Benefit:
Auriga?s low-cost, full-duplex T/R module at S-band will drive down size and cost for large phased-array systems. The module will be well-suited for quick adaptation to many systems in the L- to X-band range, requiring multiple concurrent communication links capable of transmitting and receiving multiple beams simultaneously.

Keywords:
Mmic, T/R Module, Full-Duplex, Multi-Channel, Phased Array, S-Band, Power Amplifier, Low Noise Amplifier