R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and system components. The stack will incorporate TezzaronÂ’s patented 3-D Octopus memory, which has built-in self-test and repair capability. In Phase II we will use TezzaronÂ’s 3-D process to fabricate a prototype device.
Keywords: 3d Electronics, Rad-Hard Design, Space-Based Systems, Embedded 3d Processor / Memory
