SBIR-STTR Award

This STTR proposes to solve the problem of automated component placement (also known as intelligent packaging) for UAV's and other products by building on our unique state-of-the-art, patented technology platform. The goal of this work is to enable the automated layout of an entire complex product, such as a UAV, featuring a multitude of systems and subsystems with 3D components. This will be accomplished by developing a method for computationally decomposing a system into subsystems, solving the subsystem layout problem in sub-defined spaces with our "Extended Pattern Search" (EPS) technology, and re-integrating the subsystems together. In developing the necessary methods this project will create a tool for use on UAV's, satellites, missiles, and other military and non-military products such as printed circuit boards (PCB) and automobiles. This technology is critical for the successful evolution of UAV's for two reasons: first, time to market affects both cost and deployment of new UAV's to meet Air Force needs, and second, faster design time allows for more extensive analysis and verification of performance and quality, improving the effectiveness of the UAV program.

Keywords:
3d Packaging, Layout Optimization, Uav Design, Design Constraints, Design Objectives, Extended Pattern Search, Hierarchical Problem Solving, Satellite Design

The design of Unmanned Aerial Vehicles (UAVís) is a complex process of creating a reliable system of reasonable cost that can survive in hostile environments. Although UAVís have unique aspects to them, similar goals can be found in almost any complex, competitive product. One aspect of the design of these systems that tends to be both difficult and poorly supported with available computer design technology today is the difficult step of determining placement locations for the components within a product housing or container (the space available for component placement). In Phase I we developed technology to hierarchically cluster sets of components into subsystems, each of which can be laid out first independently and then refined as they are integrated into a complete system placement. The next challenge to clustering is to create smart clusters to enable the systemís ability to satisfy design constraints during layout of large and complex interactive systems. Constraints are especially critical and challenging in full 3D geometry where the functional interactions are highly coupled, as with UAV design. The method for computationally decomposing a system based on constraints, and solving the system and subsystem layout problem while satisfying constraints is the focus of this STTR.

Keywords:
3d Packaging, Layout Optimization, Uav Design, Design Constraints, Design Objectives, Extended Patte