SBIR-STTR Award

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Organoclay Moisture Barrier for Moisture Protection of Plastic Microcircuit Components
Award last edited on: 3/10/2003

Sponsored Program
SBIR
Awarding Agency
DOD : AF
Total Award Amount
$99,956
Award Phase
1
Solicitation Topic Code
AF02-122
Principal Investigator
Chuk L Leung

Company Information

Polycomp Technologies Inc

13963 Recuerdo Drive
Del Mar, CA 92014
   (858) 792-6486
   N/A
   N/A
Location: Single
Congr. District: 49
County: San Diego

Phase I

Contract Number: ----------
Start Date: ----    Completed: ----
Phase I year
2002
Phase I Amount
$99,956
Plastic encapsulated microcircuits use organic packaging material to protect integrated circuit dies and interconnects from environmental hazards. However because PEMs are non-hermetic its reliability in some harsh environments suffer from rapid moisture outgassing, called popcorning. PolyComo Technologies proposes to use low moisture resins reinforced with organoclay to form nanocomposites that hinders the total moisture sensitivities of these PEM packages. Commercial and military PEM will benefit from this research because the development of a moisture insensitive coating will enable the long term storage of microelectronic components without expensive dessicant or enclosures and enabling the use of these components where ambient pressure is low.

Phase II

Contract Number: ----------
Start Date: ----    Completed: ----
Phase II year
----
Phase II Amount
----