High performance electronics is in ever increasing demand across a wide variety of platforms ranging from personal computers to military and commercial aircraft. It is now possible to design and implement significant system functionality by hybrid integration of several ICs (even dozens) on a single substrate in a single package. The savings in weight, size, and total power dissipation are substantial in this multichip module (MCM) approach. Invariably, however, power density raised sharply in MCM technology, thus creating a challenge to better thermal management in dense, high performance packaging has become an important contributor to optimizing the mix of cost, performance and reliability for the entire system. Brazonics, Inc., proposes to adapt its proven core technology of forced-fluid cooling specifically to the aircraft environment. The Brazonics approach is one of high efficiency heat transport, minimum size and weight, and high reliability through simplicity. At the same time, the Brazonics concept promises to be extremely versatile and environmentally sound. The concept proposed here promises substantial reductions in system size, weight and cost with no compromise in performance or reliability.
Keywords: Electronics Cooling Cold Plate Heat Exchanger Thermal Management
