SBIR-STTR Award

Under this contract, we will develop a fundamental understanding of the effects of high power microwave (HPM) signals on integrated circuits. Specific objectives include: 1) analyze and fail components to develop an understanding of the failure processes, 2) model selected parts and develop response prediction tools, 3) design tests to quantitatively measure and separate various phenomena, 4) design printed circuit level tests to measure the response of parts 'in situ', and 5) design the instrumentation system and test fixtures. Future phases of work will verify the analysis and hardness assurance screens developed under this contract.

We will design, build and test High Power Microwave (HPM) power flow sensors and associated instrumentation. The sensors will be designed for mounting on Printed Circuit (PC) boards so that power flowing into or out of components on the PC board can be monitored. The sensors will not require electrical power, will not affect the free field hpm signal surrounding the PC board, and will not significantly alter the interaction of the HPM signal with the component being tested. Preliminary specifications for the sensors are as follows: maximum voltage: 1000 volts; maximum RMS current: 37.4 amps for loons; maximum power detection: 10k watts; dynamic range: 60db; linearity: 1%; response (10 - 90%) 5ns and physical dimensions: .625cm square by .25cm thick.