Under this contract, we will develop a fundamental understanding of the effects of high power microwave (HPM) signals on integrated circuits. Specific objectives include: 1) analyze and study failed components to develop an understanding of the failure process, 2) model selected parts and develop response prediction tools, 3) design tests to quantitatively measure and separate various phenomena, 4) design printed circuit level tests to measure the response of parts 'in situ' and 5) design the instrumentation system and test fixtures. Future phases of work will verify the analysis and hardness assurance screens developed under this contract.
