Silicon Carbide (SiC) power transistors promise to provide higher power output with fewer, smaller devises because of the wide bandgap and high breakdon threshold of SiC. Improved material properties enable SiC bipolar junction transistors (BJTs) to be fabricated, thereby offering improved stability and higher power density than comparable field effect transistors (FETs). SiC BJT's for operation from 0.5-2.0 GHz can now be designed, suitable for military and commercial communications and radar. Extreme Devices, in collaboration with HdB Engineering, will design and fabricate high frequency (1-1.5 GHz) SiC BJT's using high power, ultra high frequency rf transistor design rules and Extreme Devices' novel supersonic molecular beam epitaxy process. In Phase I of this program Extreme Devices has designed and begun fabrication of prototype SiC bipolar junction transistors for operation above 1 GHz. A number of critical issues have been addressed, including device design, doping specification and methods for contract to the very thin base called for in the design. In phase II Extreme Devises will optimize the RF Power transistor design and processing, demonstrate improved device performance, and smaple devices to select customers.
Keywords: Transistor, Silicon Carbide, Electronic Materials