SBIR-STTR Award

NexGenSemi will develop a unique semiconductor fabrication process to execute multiple AT techniques on a single wafer. During the phase I program, NexGenSemi will perform preliminary sub 90nm tests leading to the TAPO ASIC test structures to be fully executed in the phase II.

Benefit:
Provide the DOD a high speed, low cost Trusted AT manufacturing method for electronics below the 90nm node.

Keywords:
Anti-Tamper, At, Penetration, Countermeasures, Intellectual Property Protection, Smart Cards, Trusted Foundry Program Office, On-Shore

NexGenSemi will develop a unique semiconductor split fabrication process to execute multiple AT techniques into the wafer. During the phase I program, NexGenSemi perform preliminary sub 90nm tests leading to manufacturing and test. During the phase II effort, NexGenSemi will team with a US Trusted Foundry to demonstrate AT techniques providing a solution to a broader range of manufacturing.

Benefit:
Provide the DOD and Intel Agencies a high speed, low cost Trusted AT manufacturing method for electornics below the 90nm technology node.

Keywords:
Anti-Tamper, At, Countermeasures, Intellectual Property Protection, Smart Cards, Efuse