The goal of the proposed research is the development of a high-volume, low-cost manufacturing along with a novel deposition process that enables fabrication of a structural-state electronic system-on film. This hybrid electronic system contains a multifunctional sensor suite that can measure a structure's static (such as deformation, stress and strain) and dynamic state (such as slow or under acceleration). This electronic system consists of SSM patches that have been populated with sensors that have been solution-processed onto a flexible substrate. During the 7-month base Phase I effort, NextGen and UIC will develop (1) a high-volume manufacturing process, (2) a novel deposition approach for fabricated high-performance sensors, and (3) an electronic system on film. During Phase II, the design, fabrication, and testing of an array of organic strain sensors will be accomplished. Whereas in Phase I, the structural state sensing device or strain sensor was a laboratory test article, the Phase II product will be a strain sensor prototype array with more specific application performance requirements. The Technology Readiness Level (TRL) during Phase I will be elevated from a 2 to a 3. A Phase II effort would increase all three technologies to a TRL of 5.
Keywords: Cost Reduction, Cost Reduction, Printing, Organic And Inorganic Materials, Structural Health Monitoring (Shm), High-Rate Manufacturing, Hybrid Flexible Electronics, Structural
