S-Bond Technologies is a materials technology company providing bonding and assembly solutions, including active solders and brazing assemblies, for applications across many markets including electronics, defense, aerospace and general industrial markets. The firms S-Bond solders enable flux free, low temperature joining of materials such as dissimilar metals, intermetallics, ceramics, glasses, carbides and composites. S-Bond products use titanium and/or rare earth elements in addition to conventional solder alloy bases; these active elements migrate to any interface and react or interact with the opposing material surface, removing oxides and nitrides and transporting them into the bulk of the solder as an inert material or adhering to them. This process occurs while S-Bond is molten, after the thin oxide "skin" that forms on the surface of the molten S-Bond is broken, thus allowing contact between the bulk S-Bond and the substrate surface. The breaking of this skin is referred to as "activation" and is done by application of a low level of mechanical shear S-forces at the interface between the S-Bond material and the substrate. The level of shear required is small and can be delivered by brushing or scraping the surface, sliding the joining surfaces relative to one another, or application of high frequency vibration to the parts to be joined. In addition to this technology, S-Bond Technologies provides development, prototype and production bonding services along with Helium leak testing and ultrasonic C-Scan scanning services.
