Structured aorund expert iseon the fabrication of electronic packages and devices using photo-definable glass-ceramics, 3D Glass Solutions (3DGS) manufactures a wide variety of glass-based, system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® glass ceramic technology for applications in RF electronics and photonics used in automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT industries. The firm offers high-precision products with exceptional high- frequency and low-loss properties: the firm's glass ceramic-based RF products can be combined with any number of designs or devices to create incredibly unique and valuable SiP products. With a foundational patent positions related to all photosensitive glass- ceramic materials and devices. the firm owns the fundamental intellectual property for all four positions (materials, design, systems and manufacturing) related to glass-ceramic devices for the electronics packaging industry. 3DGS leverages its unique product solutions to provide device manufacturing and systems integration services for several standard and custom products
